Design for High Performance, Low Power, and Reliable 3D Integrated Circuits

EISBN:9781441995421
PISBN:9781441995414
出版社:Springer New York
出版类型:Professional book
出版时间:2013
作者:Sung Kyu Lim
主题词:Circuits and Systems,Nanotechnology and Microengineering,Processor Architectures
语种:英语
所属数据库:SpringerLink电子图书
相关推荐

Arbitrary Modeling of TSVs for 3D Integrated Circuits

  • 作者:Khaled Salah,Yehea Ismail,Alaa El-Rouby
  • EISBN:9783319076119
  • 出版社:Springer International Publishing
  • 出版时间:2015

Designing TSVs for 3D Integrated Circuits

  • 作者:Nauman Khan,Soha Hassoun
  • EISBN:9781461455080
  • 出版社:Springer New York
  • 出版时间:2013

On-Chip Current Sensors for Reliable, Secure, and Low-Power Integrated Circuits

  • 作者:Rodrigo Possamai Bastos,Frank Sill Torres
  • EISBN:9783030293536
  • 出版社:Springer International Publishing
  • 出版时间:2020

Next-Generation ADCs, High-Performance Power Management, and Technology Considerations for Advanced Integrated Circuits

  • 作者:Andrea Baschirotto,Pieter Harpe,Kofi A. A. Makinwa
  • EISBN:9783030252670
  • 出版社:Springer International Publishing
  • 出版时间:2020

Low-Power Design Techniques and CAD Tools for Analog and RF Integrated Circuits

  • 作者:Piet Wambacq,Georges Gielen,John Gerrits,Rene Leuken,Alexander Graaf,Reinder Nouta
  • EISBN:9780306480898
  • 出版社:Springer US
  • 出版时间:2001