Handbook of 3D Integration - Vol. 4 - Design, Test, and Thermal Management

PISBN:9783527697052
出版社:John Wiley & Sons, Inc
出版时间:2019
作者:Franzon
主题词:Physical Sciences & Engineering
语种:英语
所属数据库:Wiley电子图书
相关推荐

Design and Test Strategies for 2D/3D Integration for NoC-based Multicore Architectures

  • 作者:Kanchan Manna,Jimson Mathew
  • EISBN:9783030313104
  • 出版社:Springer International Publishing
  • 出版时间:2020

Handbook of 3D Integration Volume 3 - 3D Process Technology

  • 作者:Garrou
  • PISBN:9783527670109
  • 出版社:John Wiley & Sons, Inc
  • 出版时间:2014

Design-for-Test and Test Optimization Techniques for TSV-based 3D Stacked ICs

  • 作者:Brandon Noia,Krishnendu Chakrabarty
  • EISBN:9783319023786
  • 出版社:Springer International Publishing
  • 出版时间:2014

Foundations of Heterogeneous Integration: An Industry-Based, 2.5D/3D Pathfinding and Co-Design Approach

  • 作者:Farhang Yazdani
  • EISBN:9783319757698
  • 出版社:Springer International Publishing
  • 出版时间:2018

3D and Circuit Integration of MEMS

  • 作者:Esashi
  • EISBN:9783527823239
  • 出版社:Wiley
  • 出版时间:2021