3D Microelectronic Packaging

EISBN:9783319445861
PISBN:9783319445847
出版社:Springer International Publishing
出版类型:Monograph
出版时间:2017
版次:1st ed. 2017
作者:Yan Li,Deepak Goyal
主题词:Electronics and Microelectronics,Instrumentation,Optical and Electronic Materials,Electronic Circuits and Devices,Microengineering,Nanotechnology and Microengineering,Metallic Materials
语种:英语
所属数据库:SpringerLink电子图书
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