相关推荐

Integrated Circuit Packaging, Assembly and Interconnections

  • 作者:William J. Greig
  • EISBN:9780387339139
  • 出版社:Springer US
  • 出版时间:2007

Thermal Management Materials for Electronic Packaging - Preparation, Characterization, and Devices

  • 作者:Tian
  • EISBN:9783527843121
  • 出版社:Wiley
  • 出版时间:2023

From LED to Solid State Lighting - Principles, Materials, Packaging, Characterization, and Applications

  • 作者:Lee
  • EISBN:9781118881620
  • 出版社:Wiley
  • 出版时间:2021

Advances in Electronic Circuit Packaging

  • 作者:Gerald A. Walker
  • EISBN:9781489973115
  • 出版社:Springer US
  • 出版时间:1962

Integrated Circuit Design

  • 作者:Dimitrios Soudris,Peter Pirsch,Erich Barke
  • EISBN:9783540453734
  • 出版社:Springer Berlin Heidelberg
  • 出版时间:2000

Materials Characterization

  • 作者:Ramiro Pérez Campos,Antonio Contreras Cuevas,Rodrigo Esparza Muñoz
  • EISBN:9783319152042
  • 出版社:Springer International Publishing
  • 出版时间:2015