Proceedings of the Seventh IEEE CPMT Conference on High Density Microsystem Design and Packaging Com

出版社:Piscataway, N.J. : Institute of Electrical and Electronics Engineers, c2006.
ISBN:0780392922
出版年:2005
作者:IEEE CPMT Conference on High Density Microsystem Design and Packaging Component Failure Analysis
资源类型:图书
细分类型:西文文献
相关推荐

Proceeding of the Sixth IEEE CPMT Conference on High Density Microsystem Design and Packaging and Co

  • 作者:IEEE CPMT Conference on High Density Microsystem Design and Packaging Component Failure Analysis
  • ISBN:0780386205
  • 出版社:Piscataway, N.J. : IEEE, c2004.
  • 出版年:2004

2006 Conference on High Density Microsystem Design and Packaging and Component Failure Analysis : 27

  • 作者:IEEE CPMT Conference on High Density Microsystem Design and Packaging Component Failure Analysis
  • ISBN:1424404886
  • 出版社:Piscataway, N.J. : IEEE, c2006.
  • 出版年:2006

2007 International Symposium on High Density Design, Packaging and Microsystem Integration : Shangha

  • 作者:International Symposium on High Density Design,Packaging and Microsystem Integration
  • ISBN:1424412528
  • 出版社:Piscataway, N.J. : IEEE, c2007.
  • 出版年:2007

1999 international conference on high density packaging and MCMs

  • 作者:International Conference on High Density Packaging and MCMs
  • ISBN:0930815572
  • 出版社:Bellingham : SPIE, 1999.
  • 出版年:1999

2001 HD International Conference on High-Density Interconnect and Systems Packaging : proceedings :

  • 作者:International Conference on High-Density Interconnect and Systems Packaging
  • ISBN:0930815637
  • 出版社:Bellingham, Wash. : SPIE, c2001.
  • 出版年:2001

2008 International Conference on Electronic Packaging Technology & High Density Packaging : Shanghai

  • 作者:International Conference on Electronic Packaging Technology & High Density Packaging
  • ISBN:9781424427390
  • 出版社:Piscataway, N.J. : IEEE, c2007.
  • 出版年:2008