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Proceedings of the Seventh IEEE CPMT Conference on High Density Microsystem Design and Packaging Com
出版社:
Piscataway, N.J. : Institute of Electrical and Electronics Engineers, c2006.
ISBN:
0780392922
出版年:
2005
作者:
IEEE CPMT Conference on High Density Microsystem Design and Packaging Component Failure Analysis
资源类型:
图书
细分类型:
西文文献
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