《UCR researchers discover new method to dissipate heat in electronic devices》
来源专题：水声领域信息监测
发布时间：2016-11-14
RIVERSIDE, Calif. -- Controlling the flow of heat through semiconductor materials is an important challenge in developing smaller and faster computer chips, high-performance solar panels, and better lasers and biomedical devices.
Home.Physics.Optics & Photonics.. . . November 18, 2019 Researchers create better light-trapping devices. by University of Pennsylvania An abstract depiction of the optical resonator’s nine unique topological charges. The separate charges are able to merge together, akin to how waves in the ocean can crash together and either form larger waves or cancel one another out. The wavy landscape along the bottom of the image connects to ...
Abstract
New electronic materials have the potential to enable wearable computers, personal health monitors, wall-scale displays and other systems that are not easily achieved with established wafer based technologies. A traditional focus of this field is on the development of materials for circuits that can be formed on bendable substrates, such as sheets of plastic or steel foil. More recent efforts seek to achieve similar systems on fully elastic substrates for electronics that can be stretched, compressed, twisted and deformed in ways that are much more extreme than simple bending. This article highlights some recent progress in this area, with an emphasis on materials approaches and demonstrated devices.
