PISBN:9781845694746
出版社:Woodhead Publishing
出版时间:2010
作者:Lawrence,Jonathan
主题词:Laser Additive Manufacturing,Laser Direct Writing,Micro-Sized Coatings,Process Characterization,Properties Of Micro-Sized Coatings,3D Printers,Biomedical Engineering,Coatings,Crystal Microstructure,Crystal Structure,Deposition,Laser Applications,Laser Beams,Manufacture,Microelectronics,Optical Waveguides,Additive Fabrication,Direct-Write Technology,Engineering Applications,Laser Additive Manufacturing,Laser Direct Writing,Material Processing,Mechanical Behavior,Process Characterization,Laser Materials Processing,Laser Cladding,Laser Melting,Laser Sintering,Micro Stereo Lithography,Rapid Manufacturing,Rapid Prototyping,Two-Photon Laser Lithography,3D Printers,Cost Effectiveness,Laser Cladding,Laser Heating,Manufacture,Microoptics,Rapid Prototyping,Sintering,Laser Melting,Laser Sintering,Micro-Stereo Lithography,Rapid Manufacturing,Two-Photon Laser Lithography,Laser Applications,Additive Processing,Laser Micro-Cladding (Lmc),Laser Micro-Fabrication (Lmf),Subtractive Processing,Ablation,Bonding,Chemical Bonds,Chemical Vapor Deposition,Cutting Tools,Deposition,Laser Ablation,Vapor Deposition,Additive Processing,Chemical Vapour Deposition,Laser Micro Welding,Laser Micro-Cladding,Laser Micro-Fabrication,Micro /Nano Fabrications,Subtractive Method,Subtractive Processing,Cutting,Ablation,Debris Control,Excimer,Flowing Liquid Immersion,Micromachining,Ablation,Debris,Etching,Micromachining,Thick Films,Van Der Waals Forces,Capillary Force,Excimers,Filtered Water,Flowing Liquid,Laser Etching,Mechanical Etching,Short Wavelengths,Van Der Waals,Laser Ablation,Aluminium Alloys,Combined Laser Cutting And Laser Welding,High-Strength Steels,Laser Combi-Head,Laser-Arc Hybrid Welding,Alloy Steel,Aluminum Alloys,Electric Welding,High Strength Alloys,Laser Beam Welding,Welding,Combi-Heads,Degree Of Flexibility,Laser Cutting,Laser-Arc Hybrid Welding,Laser-Mag Hybrid Welding,Process Limits,State Of The Art,Welding Process,High Strength Steel,Aluminium Alloys,Assist Gas,Ceramics,Laser Cutting,Nozzles,Aluminum Alloys,Laser Applications,Laser Beam Cutting,Laser Beams,Nozzles,Assist Gas,Ceramics,Difficult Material,Laser Cutting,Cutting,316L,Al 447,Cpm-9V,Functional Component,H13,In-625,In-738,Laser Consolidation,Net-Shape,Rapid Manufacturing,Rapid Prototyping,Stellite 6,Ti-6Al-4V,Aluminum,Computer Aided Manufacturing,Industrial Research,Laser Applications,Machining,Manufacture,Rapid Prototyping,316L,Functional Components,Net Shape,Rapid Manufacturing,Stellite 6,Ti-6 Al-4 V,Laser Materials Processing,Aluminium,Copper,Dissimilar Metals,Laser Micro Joining,Laser Micro Welding,Aluminum,Copper,Dissimilar Metals,Fatigue Testing,Joining,Laser Beams,Microstructure,Solar Energy,Welds,Beam Incidence Angle,Electronic Application,Electronics Production,Intermetallic Phasis,Laser Micro Welding,Micro-Joining,Solar Energy Collectors,Thermal And Electrical Properties,Welding,Complementary Metal-Oxide-Silicon,Dopant Activation,Excimer Laser,Pulsed Laser Annealing,Silicide,Ultrashallow Junction,Annealing,Chemical Activation,Doping (Additives),Excimer Lasers,Metals,Semiconductor Junctions,Semiconductor Lasers,Silicides,Dopant Activation,Dopant Diffusion,Interface Characteristic,Metal Oxides,Nano-Scale Fabrication,Pulsed Laser Annealing,Silicon-Based Devices,Ultra Shallow Junction,Pulsed Lasers,Bioceramics,Bioglass,Calcium Phosphate,Coatings,Laser Cladding,Pulsed Laser Deposition,Bioactive Glass,Bioceramics,Bone,Calcium,Calcium Phosphate,Ceramic Materials,Coatings,Deposition,Laser Cladding,Phosphate Coatings,Pulsed Laser Deposition,Apatitic Calcium Phosphates,Bioceramic Coatings,Biomaterial Coatings,Bone Defect,Implant Devices,Laser-Assisted Process,Osteointegration,Pulsed-Laser Deposition Technique,Pulsed Lasers,Biomolecule Printing,Laser Direct-Writing,Laser-Induced Forward Transfer,Lift,Micropatterning,Biomolecules,Lift,Mass Transfer,Optical Waveguides,Printing,Direct Writing,Laser Direct Writing,Laser Induced Forward Transfer,Micro Patterning,Microprinting,Print Materials,Simple Metals,Solid Substrates,Laser Beam Effects,Glass,Laser Cleaving,Thermal Stress,Carbon Dioxide,Finite Element Method,Glass,Laser Beams,Lime,Neodymium,Shear Stress,Substrates,Thermal Stress,Complex Stress State,Cutting Quality,Elastic Finite Element Method,Glass Substrates,High Temperature,Innovative Technology,Laser Cleaving,Soda Lime Glass Substrate,Pulsed Lasers,Composite,Fibre Removal,Fibre-Reinforced Plastic,Laser Machining,Material Removal Mechanism,Carbon,Carbon Fiber Reinforced Plastics,Carbon Fibers,Composite Materials,Fiber Reinforced Plastics,Fibers,Heat Affected Zone,Heat Transfer,Laser Beams,Reinforced Plastics,Reinforcement,Ultraviolet Lasers,Experimental Investigations,Inhomogeneous Materials,Laser Machining,Laser Process,Laser Processing Parameters,Material Removal Mechanisms,Transfer Phenomenon,Uv Lasers,Laser Materials Processing,Beam Shaping,Control,Grey Cast Iron,Hardening,Laser,Monitoring,Production Systems,Steel,Cast Iron,Control,Hardening,Laser Applications,Laser Beam Welding,Lasers,Monitoring,Steel,Beam Shaping Technique,Beam-Shaping,Grey Cast Iron,Laser Beam Hardening,Laser Transformation Hardening,Measuring Technique,Production System,Treatment Technologies,Laser Beams,Cladding,Direct Metal Deposition,Laser Powder Deposition,Rapid Manufacturing,Cladding (Coating),Deposition,Laser Applications,Laser Theory,Manufacture,Commercial Systems,Direct Metal Deposition,Industrial Users,Laser Powder Deposition,Multiple Layers,Powder Deposition,Process Parameters,Rapid Manufacturing,Powder Metals,Laser Processing,Monitoring And Control,Closed Loop Control Systems,Process Control,Quality Control,Closed-Loop Control,Laser Process,Materials Processing,Monitoring And Control,Online Monitoring,Open-Loop,Workpiece,Laser Materials Processing,Laser Spot Welding,Laser-Induced Plasma/Plume,Porosity,Weld Penetration,Welding Defects,Continuous Wave Lasers,Defects,Laser Beam Effects,Laser Beam Welding,Laser Beams,Laser Produced Plasmas,Porosity,Process Control,Process Monitoring,Spot Welding,Welding,Welds,Formation Mechanism,In-Process Monitoring,Laser Induced Plasma,Laser Spot Welding,Laser-Induced Plume,Solidification Cracking,Weld Penetrations,Welding Defects,Pulsed Lasers,In Situ Temperature Distribution,Laser Cutting,Laser Dicing,Plasma Measurement,Printed Circuit Boards,Silicon Wafer,Cutting,Dielectric Materials,Laser Applications,Laser Beam Cutting,Laser Beams,Low-K Dielectric,Silicon,Silicon Wafers,Substrates,High Speed Laser,In-Situ Temperature,Laser Cutting,Laser Dicing,Laser Profiles,Plasma Measurement,Printed Circuit Board (Pcbs),Recent Researches,Printed Circuit Boards,Cutting,Laser Drilling,Laser Material Processing,Optical Energy Characteristics,Other Processes,Welding,Cutting,Electromagnetic Waves,Welding,Industrial Energy,Industrial Power,Industrial Practices,Laser Drilling,Laser Material Processing,Laser Process,New Applications,Optical Energy,Laser Materials Processing,Challenges,Cutting,Laser Processing,Micro-Fabrication,Welding,Cutting,Industrial Research,Manufacture,Welding,Challenges,Laser Cutting,Laser Process,Micro /Nano Fabrications,Nano-Manufacturing,Surface Engineering,Laser Materials Processing,Laser Forming,Laser Shock Peening (Lsp),Plasticity,Thermal Forming,Direct Energy Conversion,Energy Conversion,Plastic Deformation,Plasticity,Deformation Process,Laser Energies,Laser Peen Forming,Laser Shock Peening,Laser-Forming,Mechanical Deformation,Part Geometry,Thermal Forming,Forming,Keyhole Geometry Dynamics,Keyhole Laser Welding,Keyhole Modelling,Melt Pool Dynamics,Vapour Plume Interaction,Dynamics,Laser Beam Welding,Welding,Keyhole Geometry,Keyhole Parameters,Melt Pool Dynamics,Physical Mechanism,Physical Process,Plume Interaction,Specific Regime,Welding Speed,Lakes,Coating Texture,Laser Cladding,Mechanical Properties,Microstructure Of Thick Metallic Coatings,Processing Map,Laser Cladding,Mechanical Properties,Metal Coatings,Textures,Geometrical Characteristics,Metallic Coating,Microhardness Measurement,Orientation Imaging Microscopy,Processing And Properties,Processing Maps,Room And High Temperatures,Statistical Correlation,Cladding (Coating),Direct-Write,In-Situ Sintering,Laser-Sintering,Low-Temperature Substrates,Nanoparticle Inks,Laser Heating,Neodymium Lasers,Sintering,Temperature,Direct Write,In-Situ Sintering,Laser Sintering,Low Temperatures,Nanoparticle Inks,Laser Materials Processing,,Materials,Coupled Temperature And Stress Fields Modelling,Laser Solid Freeform Fabrication,Multiphysics Modelling,Three- Dimensional Numerical Modelling,,,
学科:TB1 工程基础科学
语种:英语