PISBN：9780857095022
出版社：Woodhead Publishing
出版时间：2014
作者：Nihtianov,S
主题词：Accelerometers,Gyroscopes,Inertial Measurement Units,Magnetometers,Mems Motion Sensors,Accelerometers,Gyroscopes,Magnetometers,Motion Sensors,Displacement Sensor,Electronic Systems,High-Precision,Inertial Measurement Unit,Mems Accelerometer,Memsdevices,Micro Electromechanical System (Mems),Multi-Parameter Sensor,Mems,Acoustic Mems Array,Field-Programmable Gate Arrays,Smart Sensors,Sound Localization,Acoustic Arrays,Acoustic Devices,Data Acquisition,Embedded Systems,Logic Gates,Mems,Real Time Systems,Signal Processing,Signal Receivers,Smart Sensors,Design And Implementations,Field Programmable Gate Array Platform,Micro Electro Mechanical System,Network Communications,Real Time Data Acquisition,Smart Acoustic Sensors,Sound Localization,Source Localization,Field Programmable Gate Arrays (Fpga),Field Programmable Gate Arrays (Fpgas),Flaw Detection,Nondestructive Testing,Reconfigurable Computing,System-On-Chip,Ultrasonic Signal Processing,Acoustic Signal Processing,Computer Hardware,Computer Operating Systems,Field Programmable Gate Arrays (Fpga),Hardware-Software Codesign,Image Processing,Integrated Circuit Design,Nondestructive Examination,Reconfigurable Architectures,Reconfigurable Hardware,Signal Receivers,Smart Sensors,System-On-Chip,Flaw Detection,Linux- Operating System,Non Destructive Evaluation,Reconfigurable Computing,Reconfigurable Fabrics,Smart Sensor Platforms,Ultrasonic Flaw Detection,Ultrasonic Signal Processing,Ultrasonic Testing,Intelligent Sensor Device,Metrological Self-Check,Sensor,Sensor Device,Smart Sensor Device,Biology,Mems,Sensors,Smart Sensors,Intelligent Sensor Device,Metrological Self-Check,Micro Electro Mechanical System,New Approaches,Sensor Device,Sensorics,Smart Sensor Devices,Technical Evolution,Artificial Intelligence,Bonding,Deposition,Etching,Micro-Electro-Mechanical Systems (Mems),Microfabrication,Microsystems,Photolithography,Photoresist,Polymers,Silicon,Simulation,Bonding,Deposition,Etching,Mems,Microfabrication,Microsystems,Photolithography,Photoresists,Polymers,Silicon,Micro Electromechanical System (Mems),Micro Systems Technologies,Micro-Fabrication Technology,Microfabrication Process,Process Flows,Simulation,Smart Devices,Microanalysis,Capacitive Displacement Sensor Interface,Incremental Σδ Converter,Offset Capacitance Cancellation,Switched-Capacitor Circuits,Capacitance,Capacitive Displacement Sensors,Charge Balancing,High Resolution,Interface Circuits,Offset Capacitance Cancellation,Sensor Electrodes,Subnanometer Resolution,Switched -Capacitor Circuits,Capacitive Sensors,Complementary Metal-Oxide-Semiconductor (Cmos),Image Sensor,Machine Vision,Material Classification,Metallic Wire-Grid Polarizer,Polarization Vision,Cmos Integrated Circuits,Color,Dielectric Devices,Dielectric Materials,Image Enhancement,Image Sensors,Metals,Mos Devices,Oxide Semiconductors,Polarization,Vision,Complementary Metal Oxide Semiconductors,Industrial Machine Vision,Material Classification,Metallic Wire,Physical Constraints,Polarization Imaging,Polarization Vision,Transmitted Intensities,Computer Vision,Capacitive Sensor,Microcontroller,Resistive Sensor,Sensor Electronic Interface,Controllers,Microcontrollers,Timing Circuits,Commercial Devices,Digital System,Interface Circuits,Operating Principles,Resistive Sensor,Sensor Electronic Interface,Sensor Topologies,Signal Paths,Capacitive Sensors,Displacement Measurement,Eddy-Current Sensor,Harsh Environment,Integrated Interface,Resolution,Stability,Convergence Of Numerical Methods,Eddy Currents,Inductive Sensors,Interface States,Optical Resolving Power,Eddy Current Displacement Sensors,Eddy Current Sensors,Harsh Environment,Inductive Displacement Sensors,Industrial Environments,Integrated Interface,Measurement Techniques,Performance Limitations,Displacement Measurement,Ejection,Electrohydrodynamic (Ehd),Inkjet,Mems,Print,Cost Effectiveness,Digital Devices,Electrohydrodynamics,Nanostructures,Printing,Ejection,Electrohydrodynamic (Ehd),Environmental Friendliness,Industrial Printing,Inkjet,Micro Electromechanical System (Mems),Performance Indices,Printed Electronics,Mems,Parasitic Capacitive Effects,Resistance-To-Time Conversion Method,Resistive Sensor Interface,Weighted Least Mean Squares Linearization,Wide-Range Resistance Measurement,Data Acquisition,Least Squares Approximations,Readout Systems,Capacitive Effect,Least Mean Square(Lms),Resistance Measurement,Resistance-To-Time Conversion,Resistive Sensor,Capacitive Sensors,Dynamic Response,Electromechanical Coupling,Energy Dissipation,Mems Resonators,Quality Factor,Dynamic Response,Electromechanical Coupling,Energy Dissipation,Mems,Microelectromechanical Devices,Resonators,Dynamical Response,Geometrical Configurations,High Quality Factors,Mechanical Structures,Mems Resonators,Micro Electromechanical System (Mems),Operating Condition,Quality Factors,Damping,Electrostatic,Microelectromechanical Systems (Mems),Piezoelectric And Electrothermal Microactuators,Electric Heating,Electromechanical Devices,Electrostatics,Mems,Piezoelectricity,Actuation Principles,Design And Technology,Design Models,Electro-Thermal Microactuators,Micro Electromechanical System (Mems),Micro-Fabrication Techniques,Output Performance,Microactuators,Energy Harvesting,Fuel Cell,Photovoltaic Mini-Modules,Solar Energy,Sun Sensor,Energy Harvesting,Energy Management,Fuel Cells,Implants (Surgical),Mems,Microelectromechanical Devices,Photovoltaic Cells,Solar Energy,Solar Power Generation,Feasible Alternatives,Fuel Cell Technologies,Micro Electromechanical System (Mems),Operating Principles,Photovoltaic Mini-Modules,Photovoltaic Systems,Portable Electronic Devices,Sun Sensor,Solar Cells,Radiation Hardness,Silicon Photodetectors,Spectral Responsivity,Vuv/Euv Radiation,Vuv/Euv Radiation Damage,Extreme Ultraviolet Lithography,Hardness,Photodetectors,Radiation Damage,Synchrotron Radiation,Electrical Substitution Radiometers,Extreme Ultraviolet Radiations,Monochromatized Synchrotron Radiation,Radiation Hardness,Silicon Photo-Detector,Silicon Radiation Detectors,Spectral Responsivity,Stringent Requirement,Silicon Detectors,Displacement Interferometer,Imaging Encoder,Interferential Encoder,Interferometers,Basic Concepts,Design Considerations,Error Sources,Interferential Encoder,Interferometer Systems,Optical Encoder,Signal Encoding,Microsystems,Microwave,Radio Frequency Micro-Electro-Mechanical Systems (Rf-Mems),Mechanics,Microsystems,Microwaves,Radio Waves,Reconfigurable Hardware,Integrated Circuits (Ics),Micro Electro Mechanical System,Power Capability,Radio Frequencies,Radio Frequency-Mems,Reconfigurable Circuits,Rf Mems Technology,Smart Communication,Mems,
学科：TB4 工程材料学
语种：英语
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