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2019 Symposium on Design Test Integration & Packaging of MEMS and MOEMS (DTIP 2019) : Paris Franc
出版社：Piscataway, N.J. : IEEE, 2019.
ISBN：9781728132570
出版年：2019
作者：Symposium on Design,Test,Integration and Packaging of MEMS/MOEMS
资源类型：图书
细分类型：西文文献
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