Microelectronic Packaging Conference Nov. 20-22 1968.

出版社:New York : Society of Automotive Engineers, 1968.
ISBN:RMB1.40
出版年:1968
作者:Society of Automotive Engineers.
资源类型:图书
细分类型:西文文献
相关推荐

Microelectronic Packaging Conference, Nov. 20-22, 1968.

  • 作者:Society of Automotive Engineers.
  • 出版社:New York : Society of Automotive Engineers, 1968.
  • 出版年:1968

International Conference on Optoelectronic and Microelectronic Technology and Application : 20-22 Oc

  • 作者:International Conference on Optoelectronic and Microelectronic Technology and Application
  • ISBN:9781510640696
  • 出版社:Bellingham, Washington : SPIE, 2021.,Bellingham, Washington : SPIE, 2020.
  • 出版年:2020

Proceedings of the 3d Conference on Dimensioning and Strength Calculation, Bp., Nov. 1968.

  • 作者:Hungarian Academy of Sciences.
  • 出版社:Budapest : Akademiai Kiado, 1961.
  • 出版年:1961

Sixth International Reinforced Plastics Conference, the Royal Garden Hotel, London 13-15 Nov. 1968.

  • 作者:International Reinforced Plastics Conference
  • 出版社:London : British Plastics Federation, [1968]
  • 出版年:1968

2016 International Conference on Electronics Packaging (ICEP 2016) : Hokkaido, Japan, 20-22 April 20

  • 作者:International Conference on Electronics Packaging
  • ISBN:9781509019274
  • 出版社:Piscataway, N.J. : IEEE, c2016.
  • 出版年:2016

Proceedings of the International Conference, Wash., Nov. 10-15, 1968. Ed. by Ruth Farmakes. Sponsore

  • 作者:International Conference on the Constructive Uses of Atomic Energy,
  • 出版社:Hinsdale, ANS., American Nuclear Society, 1969.
  • 出版年:1969