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2008 3rd International Microsystems Packaging Assembly & Circuits Technology Conferenc (IMPACT) &
出版社：Piscataway, N.J. : Institute of Electrical and Electronics Engineers, c2008.
ISBN：9781424436231
出版年：2008
作者：International Microsystems,Packaging,Assembly,and Circuits Technology Conference
资源类型：图书
细分类型：西文文献
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