Electronics packaging 3

出版社:Pennington, N.J. : Electrochemical Society, c2009.
ISBN:9781615672967
出版年:2009
作者:Hayase,M.
资源类型:图书
细分类型:西文文献
相关推荐

Processing materials of 3D interconnects, damascene and electronics packaging 8

  • 作者:Kondo,K.,
  • ISBN:9781607687245
  • 出版社:Pennington, N.J : Electrochemical Society, 2017.
  • 出版年:2017

Processing materials of 3D interconnects, damascene and electronics packaging 6

  • 作者:Kondo,K.
  • ISBN:9781623322632
  • 出版社:Pennington, N.J : Electrochemical Society, 2015.
  • 出版年:2015

Processing materials of 3D interconnects, damascene and electronics packaging 7

  • 作者:Kondo,K.
  • ISBN:9781623323134
  • 出版社:Pennington, N.J : Electrochemical Society, 2015.
  • 出版年:2015

Processing materials of 3D interconnects, damascene and electronics packaging 4

  • 作者:Kondo,K.
  • ISBN:9781623320683
  • 出版社:Pennington, N.J : Electrochemical Society, 2013.
  • 出版年:2013

Nanopackaging : nanotechnologies and electronics packaging

  • 作者:Morris,James E.,
  • ISBN:9780387473253
  • 出版社:New York : Springer, c2008.
  • 出版年:2008

Electronics packaging 2

  • 作者:Wu,B.
  • ISBN:9781604233698
  • 出版社:Pennington, N.J. : Electrochemical Society, c2007.
  • 出版年:2007