登录
 机构网站
  1. 首页
  2. 馆藏纸本
  3. 图书详情
...

Materials integration and packaging issues for high-frequency devices II : symposium held November
出版社：Warrendale, Pa. : Materials Research Society, c2005.
ISBN：1558997814
出版年：2005
作者：Cho,Yong S.
资源类型：图书
细分类型：西文文献
1浏览量
 馆际互借
访问借阅管理系统
相关推荐
...

Materials, integration and packaging issues for high-frequency devices : symposium held December 1-3
  • 作者：Muralt,P.
  • ISBN：9781107409361
  • 出版社：Cambridge : Cambridge University Press, 2014.
  • 出版年：2014
...

Materials, integration and packaging issues for high-frequency devices : symposium held December 1-3
  • 作者：Muralt,P.
  • ISBN：1558997210
  • 出版社：Warrendale, Pa. : Materials Research Society, c2004.
  • 出版年：2004
...

High-frequency characterization of electronic packaging
  • 作者：Martens,Luc,
  • ISBN：0792383079
  • 出版社：Boston : Kluwer Academic Publishers, c1998.
  • 出版年：1998
...

Contemporary developments in high-frequency photonic devices
  • 作者：Bhattacharyya,Siddhartha,
  • ISBN：9781522585312
  • 出版社：Hershey, PA , USA : IGI Global, Engineering Science Reference, (an imprint of IGI Global), 2019.
  • 出版年：2019
...

High-frequency application of semiconductor devices
  • 作者：Kovács,Ferenc,
  • ISBN：0444997563
  • 出版社：Amsterdam ; New York : Elsevier Scientific Pub. Co. ; New York : distribution for the U.S.A. and Can
  • 出版年：1981
...

Materials issues for tunable RF and microwave devices : symposium held November 30-December 2, 1999,
  • 作者：Jia,Quanxi,
  • ISBN：1558995110
  • 出版社：Warrendale, Pa. : Materials Research Society, c2000.
  • 出版年：2000