登录
 机构网站
  1. 首页
  2. 馆藏纸本
  3. 图书详情
...

2011 12th International Conference on Electronic Packaging Technology and High Density Packaging (IC
出版社：Piscataway, N.J. : IEEE, c2011.
ISBN：9781457717703
出版年：2011
作者：International Conference on Electronic Packaging Technology & High Density Packaging
资源类型：图书
细分类型：西文文献
1浏览量
 馆际互借
访问借阅管理系统
相关推荐
...

2008 International Conference on Electronic Packaging Technology & High Density Packaging : Shanghai
  • 作者：International Conference on Electronic Packaging Technology & High Density Packaging
  • ISBN：9781424427390
  • 出版社：Piscataway, N.J. : IEEE, c2007.
  • 出版年：2008
...

2010 11th International Conference on Electronic Packaging Technology & High Density Packaging (ICEP
  • 作者：International Conference on Electronic Packaging Technology & High Density Packaging
  • ISBN：9781424481408
  • 出版社：Piscataway, N.J. : IEEE, c2010.
  • 出版年：2010
...

2012 13th International Conference on Electronic Packaging Technology & High Density Packaging (ICEP
  • 作者：International Conference on Electronic Packaging Technology & High Density Packaging
  • ISBN：9781467316828
  • 出版社：Piscataway, N.J. : IEEE Computer Society, c2012.
  • 出版年：2012
...

2009 International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP
  • 作者：International Conference on Electronic Packaging Technology & High Density Packaging
  • ISBN：9781424446582
  • 出版社：Piscataway, N.J. : IEEE, c2009.
  • 出版年：2009
...

1999 international conference on high density packaging and MCMs
  • 作者：International Conference on High Density Packaging and MCMs
  • ISBN：0930815572
  • 出版社：Bellingham : SPIE, 1999.
  • 出版年：1999
...

2017 12th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT
  • 作者：International Microsystems,Packaging,Assembly and Circuits Technology Conference
  • ISBN：9781538647202
  • 出版社：Piscataway, N.J. : IEEE, 2017.
  • 出版年：2017